Kirjahaku

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.

This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.

Besides offering significant advantages over traditional rigid boards, flexible circuitry is increasingly the technology of choice for military and commercial applications, including the growing ASICs market. This book addresses the many new uses, applications, and developments of flexible circuitry, the most popular form of interconnection for applications requiring size and weight reduction, better impedance, reduced labour, and easy assembly. Written by authors drawn from the largest US flex suppliers, this reference provides a ground-up perspective on modern flexible circuitry. It explores current design guidelines and uses case studies to illustrate the different thinking processes and trade-offs necessary to take full advantage of flex technology. The chapter on implementation deals with such key issues as interconnection, assembly, and circuit layout. This book aims to familiarize printed circuit designers and engineers, system engineers, and packaging engineers with the full spectrum of present-day flex circuitry principles and applications.

Ken Gilleo's Polymer Thick Film provides you with all the essential concepts, process descriptions, performance data, and general information you will need to reach your own conclusions. The focus will be on polymer thick film's major subsets, which include conductive inks, printed resistors, dielectric films or pastes, and polymer assembly material.