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1000 tulosta hakusanalla Michael Pecht

Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications

Haleh Ardebili; Michael G. Pecht

William Andrew Publishing
2009
sidottu
Electronics are used in a wide range of applications including computing, communication, biomedical, automotive, military and aerospace. They must operate in varying temperature and humidity environments including indoor controlled conditions and outdoor climate changes. Moisture, ionic contamination, heat, radiation and mechanical stresses are all highly detrimental to electronic devices and can lead to device failures. Therefore, it is essential that the electronic devices be packaged for protection from their intended environments, as well as to provide handling, assembly, electrical and thermal considerations. Currently, more than 99% of microelectronic devices are plastic encapsulated. Improvements in encapsulant materials, and cost incentives have stretched the application boundaries for plastic electronic packages. Many electronic applications that traditionally used hermetic packages such as military are now using commercial-off-the-shelf (COTS) plastic packages. Plastic encapsulation has the advantages of low cost, smaller form factors, and improved manufacturability. With recent trends in environmental awareness, new environmentally friendly or ' green' encapsulant materials (i.e. without brominated additives) have emerged. Plastic packages are also being considered for use in extreme high and low temperature electronics. 3-D packaging and wafer-level-packaging (WLP) require unique encapsulation techniques. Encapsulant materials are also being developed for micro-electro-mechanical systems (MEMS), bio-MEMS, bio-electronics, and organic light-emitting diodes (O-LEDs). This book offers a comprehensive discussion of encapsulants in electronic applications. The main emphasis is on the encapsulation of microelectronic devices; however, the encapsulation of connectors and transformers is also addressed. This book discusses 2-D and 3-D packaging and encapsulation, encapsulation materials including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification process for encapsulated packages. This book also provides information on the trends and challenges of encapsulation and microelectronic packages including application of nanotechnology.
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Influence of Temperature on Microelectronics and System Reliability

Influence of Temperature on Microelectronics and System Reliability

Pradeep Lall; Michael G. Pecht; Edward B. Hakim

CRC Press Inc
1997
sidottu
This book raises the level of understanding of thermal design criteria. It provides the design team with sufficient knowledge to help them evaluate device architecture trade-offs and the effects of operating temperatures. The author provides readers a sound scientific basis for system operation at realistic steady state temperatures without reliability penalties. Higher temperature performance than is commonly recommended is shown to be cost effective in production for life cycle costs. The microelectronic package considered in the book is assumed to consist of a semiconductor device with first-level interconnects that may be wirebonds, flip-chip, or tape automated bonds; die attach; substrate; substrate attach; case; lid; lid seal; and lead seal. The temperature effects on electrical parameters of both bipolar and MOSFET devices are discussed, and models quantifying the temperature effects on package elements are identified. Temperature-related models have been used to derive derating criteria for determining the maximum and minimum allowable temperature stresses for a given microelectronic package architecture. The first chapter outlines problems with some of the current modeling strategies. The next two chapters present microelectronic device failure mechanisms in terms of their dependence on steady state temperature, temperature cycle, temperature gradient, and rate of change of temperature at the chip and package level. Physics-of-failure based models used to characterize these failure mechanisms are identified and the variabilities in temperature dependence of each of the failure mechanisms are characterized. Chapters 4 and 5 describe the effects of temperature on the performance characteristics of MOS and bipolar devices. Chapter 6 discusses using high-temperature stress screens, including burn-in, for high-reliability applications. The burn-in conditions used by some manufacturers are examined and a physics-of-failure approach is described. The
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Optimum Cooling of Data Centers

Optimum Cooling of Data Centers

Jun Dai; Michael M. Ohadi; Diganta Das; Michael G. Pecht

Springer-Verlag New York Inc.
2013
sidottu
This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM).This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure.Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers.Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service.Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.
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Optimum Cooling of Data Centers

Optimum Cooling of Data Centers

Jun Dai; Michael M. Ohadi; Diganta Das; Michael G. Pecht

Springer-Verlag New York Inc.
2016
nidottu
This book describes the use of free air cooling to improve the efficiency of, and cooling of, equipment for use in telecom infrastructures. Discussed at length is the cooling of communication installation rooms such as data centers or base stations, and this is intended as a valuable tool for the people designing and manufacturing key parts of communication networks. This book provides an introduction to current cooling methods used for energy reduction, and also compares present cooling methods in use in the field. The qualification methods and standard reliability assessments are reviewed, and their inability to assess the risks of free air cooling is discussed. The method of identifying the risks associated with free air cooling on equipment performance and reliability is introduced. A novel method of assessment for free air cooling is also proposed that utilizes prognostics and health management (PHM).This book also: Describes how the implementation of free air cooling can save energy for cooling within the telecommunications infrastructure.Analyzes the potential risks and failures of mechanisms possible in the implementation of free air cooling, which benefits manufacturers and equipment designers.Presents prognostics-based assessments to identify and mitigate the risks of telecommunications equipment under free air cooling conditions, which can provide the early warning of equipment failures at operation stage without disturbing the data centers' service.Optimum Cooling for Data Centers is an ideal book for researchers and engineers interested in designing and manufacturing equipment for use in telecom infrastructures.
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Encapsulation Technologies for Electronic Applications

Encapsulation Technologies for Electronic Applications

Haleh Ardebili; Jiawei Zhang; Michael G. Pecht

William Andrew Publishing
2018
nidottu
Encapsulation Technologies for Electronic Applications, Second Edition, offers an updated, comprehensive discussion of encapsulants in electronic applications, with a primary emphasis on the encapsulation of microelectronic devices and connectors and transformers. It includes sections on 2-D and 3-D packaging and encapsulation, encapsulation materials, including environmentally friendly 'green' encapsulants, and the properties and characterization of encapsulants. Furthermore, this book provides an extensive discussion on the defects and failures related to encapsulation, how to analyze such defects and failures, and how to apply quality assurance and qualification processes for encapsulated packages. In addition, users will find information on the trends and challenges of encapsulation and microelectronic packages, including the application of nanotechnology. Increasing functionality of semiconductor devices and higher end used expectations in the last 5 to 10 years has driven development in packaging and interconnected technologies. The demands for higher miniaturization, higher integration of functions, higher clock rates and data, and higher reliability influence almost all materials used for advanced electronics packaging, hence this book provides a timely release on the topic.
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Reliability Engineering

Reliability Engineering

Kailash C. Kapur; Michael G. Pecht

John Wiley Sons Inc
2014
sidottu
An Integrated Approach to Product Development Reliability Engineering presents an integrated approach to the design, engineering, and management of reliability activities throughout the life cycle of a product, including concept, research and development, design, manufacturing, assembly, sales, and service. Containing illustrative guides that include worked problems, numerical examples, homework problems, a solutions manual, and class-tested materials, it demonstrates to product development and manufacturing professionals how to distribute key reliability practices throughout an organization. The authors explain how to integrate reliability methods and techniques in the Six Sigma process and Design for Six Sigma (DFSS). They also discuss relationships between warranty and reliability, as well as legal and liability issues. Other topics covered include: Reliability engineering in the 21st CenturyProbability life distributions for reliability analysisProcess control and process capabilityFailure modes, mechanisms, and effects analysisHealth monitoring and prognosticsReliability tests and reliability estimation Reliability Engineering provides a comprehensive list of references on the topics covered in each chapter. It is an invaluable resource for those interested in gaining fundamental knowledge of the practical aspects of reliability in design, manufacturing, and testing. In addition, it is useful for implementation and management of reliability programs.
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Risk-Based Engineering

Risk-Based Engineering

Prabhakar V. Varde; Michael G. Pecht

Springer Verlag, Singapore
2018
sidottu
The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a complex system offer an excellent platform for analyzing and creating risk-based models. The book also provides real-time case studies in a separate section to demonstrate the use of this approach. There are many limitations when it comes to applications of risk-based approaches to engineeringproblems. The book is structured and written in a way that addresses these key gap areas to help optimize the overall methodology. This book serves as a textbook for graduate and advanced undergraduate courses on risk and reliability in engineering. It can also be used outside the classroom for professional development courses aimed at practicing engineers or as an introduction to risk-based engineering for professionals, researchers, and students interested in the field.
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Risk-Based Engineering

Risk-Based Engineering

Prabhakar V. Varde; Michael G. Pecht

Springer Verlag, Singapore
2019
nidottu
The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on the human factor and behavioral risks. The book uses the nuclear plant, an extremely complex and high-precision engineering environment, as an example to develop the concepts discussed. The core mechanical, electronic and physical aspects of such a complex system offer an excellent platform for analyzing and creating risk-based models. The book also provides real-time case studies in a separate section to demonstrate the use of this approach. There are many limitations when it comes to applications of risk-based approaches to engineeringproblems. The book is structured and written in a way that addresses these key gap areas to help optimize the overall methodology. This book serves as a textbook for graduate and advanced undergraduate courses on risk and reliability in engineering. It can also be used outside the classroom for professional development courses aimed at practicing engineers or as an introduction to risk-based engineering for professionals, researchers, and students interested in the field.
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Strategies to the Prediction, Mitigation and Management of Product Obsolescence

Strategies to the Prediction, Mitigation and Management of Product Obsolescence

Bjoern Bartels; Ulrich Ermel; Peter Sandborn; Michael G. Pecht

John Wiley Sons Inc
2012
sidottu
Supply chains for electronic products are primarily driven by consumer electronics. Every year new mobile phones, computers and gaming consoles are introduced, driving the continued applicability of Moore's law. The semiconductor manufacturing industry is highly dynamic and releases new, better and cheaper products day by day. But what happens to long-field life products like airplanes or ships, which need the same components for decades? How do electronic and also non-electronic systems that need to be manufactured and supported of decades manage to continue operation using parts that were available for a few years at most? This book attempts to answer these questions. This is the only book on the market that covers obsolescence forecasting methodologies, including forecasting tactics for hardware and software that enable cost-effective proactive product life-cycle management. This book describes how to implement a comprehensive obsolescence management system within diverse companies. Strategies to the Prediction, Mitigation and Management of Product Obsolescence is a must-have work for all professionals in product/project management, sustainment engineering and purchasing.
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Glück mit Pech

Glück mit Pech

Michael Opelt

Amazon Digital Services LLC - Kdp Print Us
2021
pokkari
200.000 Jahre lang lebten die Menschen in einer anderen Welt als heute. Einen Arzt gab es nicht und gute Schamanen waren nicht in jeder Sippe. Wohl wussten die Einzelnen mehr ber Hilfreiches und Gesund machendes in ihrer n heren Umgebung.Viele ltere hab ich getroffen, die in ihrer Kindheit mit in den Wald gingen, um Scharrharz zu sammeln, daraus entstand auch das Pflaster von fr her.Als drei Apotheken die Pechsalbe nicht f hrten, begann ich genauer zu recherchieren und begann mich mit Wirkung und Herstellung zu besch ftige, vieles zusammenzutragen, was fast schon in Vergessenheit geriet. Je mehr ich lernte, desto begeisterter wurde ich. Die Vielzahl der Anwendungen und heilsamen Verwendungen ist berw ltigend und, es gibt keine negativen Nebenwirkungen. Heute verwende ich es fast t glich, auch weil mich dann der Geruch des Waldes umgibt.Gerne m chte ich beitragen, dass in jedem Dorf ein Mensch zum Salbenr hrer wird. TEM und Schulmedizin sollen gleichwertig sein. Wer heilt hat recht und alle Methoden zuzulassen w re das Gebot der Stunde. Heute glaubt die Wissenschaft, nur was reproduzierbar ist, ist wichtig und erkennt nicht, dass sie selbst im sehr Kleinen eines besseren belehrt wird.
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Mauerwerkstrockenlegung

Mauerwerkstrockenlegung

Michael Balak; Anton Pech

Birkhauser
2017
sidottu
Die Ursachen für die häufigsten Fehlschläge bei der Mauerwerkssanierung liegen erfahrungsgemäß in fehlender Diagnostik, unzureichender Planung, mangelhafter Ausführung, objektspezifisch falscher Materialwahl und ungeeigneter Baustoffqualität. Die jährlich vermeidbaren Bauschadenskosten betragen mehrere Millionen Euro.Die Autoren behandeln das komplexe Fachgebiet der Mauerwerksdurchfeuchtung und die effiziente Durchführung einer erfolgreichen Bauwerksanierung – von den Schadensursachen bis hin zur Abnahme der Bauleistungen. Die 3. Auflage berücksichtigt die Neufassung der normativen Grundlage in Österreich sowie aktuelle Analyse- und Verfahrensmethoden. Auf ihrer Basis wird auch die Ausbildung von Details präzise dargestellt. Das Buch ist ein Leitfaden zur erfolgreichen Bauwerksanierung.
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