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1000 tulosta hakusanalla Preeti S

Enseigner à l'ère numérique: Défis pour les stagiaires B.Ed. B.Ed.

Enseigner à l'ère numérique: Défis pour les stagiaires B.Ed. B.Ed.

Preeti Saxena; Ankita Hothi

Editions Notre Savoir
2025
nidottu
Enseigner l' re num rique: Challenges for B.Ed. est un guide complet con u pour aider les ducateurs en herbe entrer dans le monde en volution rapide de l'enseignement num rique. Ce livre aborde les d fis uniques auxquels sont confront s les stagiaires en licence d'enseignement lorsqu'ils passent des salles de classe traditionnelles des environnements d'apprentissage riches en technologie.Avec l'essor des plateformes d'apprentissage num rique, des technologies interactives et des classes virtuelles, les ducateurs d'aujourd'hui ont besoin d'une expertise en la mati re, mais aussi d'une aisance num rique, de strat gies d'enseignement innovantes et d'une capacit entrer en contact avec des tudiants natifs de l' re num rique. Ce livre fournit des id es pratiques, des d fis du monde r el et des faits fond s sur la recherche pour aider les futurs enseignants d velopper ces comp tences essentielles.
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Virtual Infrastructure Based Dynamic Routing using Mobile Sink

Virtual Infrastructure Based Dynamic Routing using Mobile Sink

Sukhwinder Singh Sran; Preeti Sood

LAP Lambert Academic Publishing
2020
pokkari
A Virtual Infrastructure Based Dynamic Routing using Mobile Sink technique for Duty Cycled Wireless Sensor Networks is proposed which uses both virtual infrastructure and duty cycled mechanism. Here virtual infrastructure implies that only subset of nodes participates in route reconstruction process. The duty cycling mechanism enables the nodes to switch between active/sleep modes to minimize the energy consumption. The results demonstrate that the proposed VIDRDC scheme decreases the energy consumption and improves the network lifetime in comparison to the existing VGDRA scheme.
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Hurdle Effect of Polyols and Fibre to Improve Quality and Shelf Life

Hurdle Effect of Polyols and Fibre to Improve Quality and Shelf Life

Suresh Bhise; Amarjeet Kaur; Preeti Shukla

Lap Lambert Academic Publishing
2024
pokkari
Polyols are hydrogenated form of carbohydrates, whose carbonyl group had been reduced to primary or secondary hydroxyl group. Fiber has many health benefits. Eating soluble fiber had been shown to reduce the risk of developing heart disease by reducing cholesterol levels. This book contains optimization of polyols (glycerol, sorbitol and mannitol) and fibres (oat, psyllium and barley) in bread and muffins to find out the best combination on the basis of quality on basis of overall acceptability of the products and evaluation of shelf life of bread and muffins prepared after incorporation of polyols and fibre in suitable packaging material.
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Quest Into Oblivion

Quest Into Oblivion

Preeti S

Notion Press
2019
pokkari
Quest Into Oblivion is the journey of a teenager to find answers to many questions her life posed for her. It also has some memories of a daughter whose parents made her feel the most valuable entity.
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Copper Wire Bonding

Copper Wire Bonding

Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; Michael G Pecht

Springer-Verlag New York Inc.
2013
sidottu
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components.In summary, this book:Introduces copper wire bonding technologiesPresents copper wire bonding processesDiscusses copper wire bonding metallurgiesCovers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishesCovers the reliability tests and concernsCovers the current implementation of copper wire bonding in the electronicsindustry Features 120 figures and tablesCopper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
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Copper Wire Bonding

Copper Wire Bonding

Preeti S Chauhan; Anupam Choubey; ZhaoWei Zhong; Michael G Pecht

Springer-Verlag New York Inc.
2016
nidottu
This critical volume provides an in-depth presentation of copper wire bonding technologies, processes and equipment, along with the economic benefits and risks. Due to the increasing cost of materials used to make electronic components, the electronics industry has been rapidly moving from high cost gold to significantly lower cost copper as a wire bonding material. However, copper wire bonding has several process and reliability concerns due to its material properties. Copper Wire Bonding book lays out the challenges involved in replacing gold with copper as a wire bond material, and includes the bonding process changes—bond force, electric flame off, current and ultrasonic energy optimization, and bonding tools and equipment changes for first and second bond formation. In addition, the bond–pad metallurgies and the use of bare and palladium-coated copper wires on aluminum are presented, and gold, nickel and palladium surface finishes are discussed. The book also discusses best practices and recommendations on the bond process, bond–pad metallurgies, and appropriate reliability tests for copper wire-bonded electronic components.In summary, this book:Introduces copper wire bonding technologiesPresents copper wire bonding processesDiscusses copper wire bonding metallurgiesCovers recent advancements in copper wire bonding including the bonding process, equipment changes, bond–pad materials and surface finishesCovers the reliability tests and concernsCovers the current implementation of copper wire bonding in the electronicsindustry Features 120 figures and tablesCopper Wire Bonding is an essential reference for industry professionals seeking detailed information on all facets of copper wire bonding technology.
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