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173 tulosta hakusanalla Doerrfeld Cori

Wintering in Hawaii in Retirement: This book documents my experiences and impressions as a retiree wintering in Hawaii.

Wintering in Hawaii in Retirement: This book documents my experiences and impressions as a retiree wintering in Hawaii.

G. R. Dornfeld

Createspace Independent Publishing Platform
2018
nidottu
After spending my entire adult working life in cold climates, I vowed to spend winters in a warm location. Initially, my wife and I tried the first winter in retirement in a rented condo in Kings Point, Del Ray Beach, Florida. This proved to be a disaster. Next, we tried renting a vacation condo on the island of Oahu, Hawaii. We liked it so much, we returned for winters over the next 10 years. This book documents our life while wintering in Hawaii.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Jianfeng Luo; David A. Dornfeld

Springer-Verlag Berlin and Heidelberg GmbH Co. K
2004
sidottu
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod­ els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
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Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Integrated Modeling of Chemical Mechanical Planarization for Sub-Micron IC Fabrication

Jianfeng Luo; David A. Dornfeld

Springer-Verlag Berlin and Heidelberg GmbH Co. K
2010
nidottu
Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod­ els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.
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