Electronic Packaging Materials and Their Properties

Kirjan Electronic Packaging Materials and Their Properties (1998) on kirjoittanut Michael Pecht. Kirjan kieli on englanti, ja sen on kustantanut CRC Press Inc. Kirja on laajuudeltaan 120 sivua ja se on sidottu.

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include:interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials soldersElectronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.