Ajay Kumar

The application of bioinformatics approaches in drug design involves an interdisciplinary array of sophisticated techniques and software tools to elucidate hidden or complex biological data. This work reviews the latest bioinformatics approaches used for drug discovery. The text covers ligand-based and structure-based approaches for computer-aided drug design, 3D pharmacophore modeling, molecular dynamics simulation, the thermodynamics of ligand-receptor and ligand-enzyme association, thermodynamic characterization and optimization, and techniques for computational genomics and proteomics.

In this book you will learn how to architect complex software using microservices architecture, so that it's flexible, scalable, and a competitive piece of software. And after completing this book, you will automatically start to think differently about software design and your architectural skills will become even stronger with a core set of design principles that will aid you to architect better software.Microservices architecture is a better way of implementing a service oriented architecture. After years of varying interpretations of a service oriented architecture, microservices is the conclusive design which provides all the advantages of the service oriented architecture approach. This book introduces microservices, discusses design, lists technology considerations, and highlights how to move forwards with microservices.This book is split up into four modules. This first module will focus on introducing microservices and on introducing the design principles associated with microservices architecture. The second module will then look at the design approach that can be taken in order to implement the microservices design principles. On completion of the second module, how to implement the microservice will become clear. The third module of the book will focus on the technology that can be used to implement microservices. Many types of technology are suggested because the architectural theory in this book can apply to any platform. The final module of the book covers how you can move forward with microservices, both in a brownfield situation and in a greenfield situation. A brown field situation is where you're going to move an existing system forward with microservices architecture. In a greenfield situation, you're basically developing a new system from scratch using microservices architecture.

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The latest advances in three-dimensional integrated circuit stacking technologyWith a focus on industrial applications, 3D IC Stacking Technology offers comprehensive coverage of design, test, and fabrication processing methods for three-dimensional device integration. Each chapter in this authoritative guide is written by industry experts and details a separate fabrication step. Future industry applications and cutting-edge design potential are also discussed. This is an essential resource for semiconductor engineers and portable device designers.3D IC Stacking Technology covers:High density through silicon stacking (TSS) technologyPractical design ecosystem for heterogeneous 3D IC productsDesign automation and TCAD tool solutions for through silicon via (TSV)-based 3D IC stackProcess integration for TSV manufacturingHigh-aspect-ratio silicon etch for TSVDielectric deposition for TSVBarrier and seed depositionCopper electrodeposition for TSVChemical mechanical polishing for TSV applicationsTemporary and permanent bondingAssembly and test aspects of TSV technology

Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Master Extreme Ultraviolet Lithography TechniquesProduce high-density, ultrafast microchips using the latest EUVL methods. Written by industry experts, Extreme Ultraviolet Lithography details the equipment, materials, and procedures required to radically extend fabrication capabilities to wavelengths of 32 nanometers and below. Work with masks and resists, configure high-reflectivity mirrors, overcome power and thermal challenges, enhance resolution, and minimize wasted energy. You will also learn how to use Mo/Si deposition technology, fine-tune performance, and optimize cost of ownership. Design EUVL-ready photomasks, resist layers, and source-collector modulesAssemble optical components, mirrors, microsteppers, and scannersHarness laser-produced and discharge pulse plasma sourcesEnhance resolution using proximity correction and phase-shift Generate modified illumination using holographic elementsMeasure critical dimensions using metrology and scatterometry Deploy stable Mo/Si coatings and high-sensitivity multilayersHandle mask defects, layer imperfections, and thermal instabilities