Kirjojen hintavertailu. Mukana 12 390 323 kirjaa ja 12 kauppaa.

Kirjailija

Chao Zhao

Kirjat ja teokset yhdessä paikassa: 3 kirjaa, julkaisuja vuosilta 2018-2026, suosituimpien joukossa Robust Design in Geotechnical Engineering. Vertaile teosten hintoja ja tarkista saatavuus suomalaisista kirjakaupoista.

3 kirjaa

Kirjojen julkaisuhaarukka 2018-2026.

Robust Design in Geotechnical Engineering

Robust Design in Geotechnical Engineering

Wenping Gong; C. Hsein Juang; Lei Wang; Chao Zhao

TAYLOR FRANCIS LTD
2026
sidottu
Ground is naturally variable and geotechnical design is based on limited information, so practice is based on uncertainties. Data on parameters, such as geotechnical properties, and solution models are poor, which result in errors in construction. Consequently the performance of a geotechnical system generally is best analysed probabilistically, with good design based on the probability of failure or the reliability index obtained. Various design approaches have been advanced to address uncertainties, such as reliability-based design, load and resistance factor design, and robust geotechnical design. This first full book on robust geotechnical design presents detailed methodologies and design examples which are reviewed alongside other methods to suit researchers and engineers.
CMOS Past, Present and Future

CMOS Past, Present and Future

Henry Radamson; Eddy Simoen; Jun Luo; Chao Zhao

Woodhead Publishing Ltd
2018
nidottu
CMOS Past, Present and Future provides insight from the basics, to the state-of-the-art of CMOS processing and electrical characterization, including the integration of Group IV semiconductors-based photonics. The book goes into the pitfalls and opportunities associated with the use of hetero-epitaxy on silicon with strain engineering and the integration of photonics and high-mobility channels on a silicon platform. It begins with the basic definitions and equations, but extends to present technologies and challenges, creating a roadmap on the origins of the technology and its evolution to the present, along with a vision for future trends. The book examines the challenges and opportunities that materials beyond silicon provide, including a close look at high-k materials and metal gate, strain engineering, channel material and mobility, and contacts. The book's key approach is on characterizations, device processing and electrical measurements.