Eby G. Friedman

Power Distribution Networks with On-Chip Decoupling Capacitors is dedicated to distributing power in high speed, high complexity integrated circuits with power levels exceeding tens of watts and the power supply below a volt. The book provides insight and intuition into the behavior and design of integrated circuit-based power distribution systems. The book has three primary objectives. The first is to describe the impedance characteristics of the overall power distribution system, from the voltage regulator through the printed circuit board and package onto the integrated circuit to the power terminals of the on-chip circuitry. The second is to discuss the inductive characteristics of on-chip power distribution grids and the related circuit behavior of these structures. The third objective is to present design methodologies for effciently placing on-chip decoupling capacitors in nanoscale integrated circuits. Power Distribution Networks with On-Chip Decoupling Capacitors is a reference for professional engineers in the fields of circuits and systems and computer-aided design.

This book explores cryogenic computers to achieve faster operation and lower energy use. As computer components become smaller and generate more heat, traditional cooling methods struggle to keep up. By operating at cryogenic temperatures, these limitations can be overcome—reducing heat, improving performance, and opening new possibilities for important applications such as large scale data centers and quantum computers. The approaches and physical models discussed in this book are valuable since these concepts offer a practical methodology for increasing computational computing power without being limited by heat and power dissipation. The book explores how cryogenic temperatures can supercharge computing. Novel methods for designing and optimizing computer systems that operate at extremely low temperatures, improve performance, reduce power consumption, and tackle the fundamental physical limits faced by modern electronics are introduced in this book. From foundational physics-based principles and cryogenic equipment to innovative graph theoretic design, the book offers a fresh look at the future of high performance, energy efficient computing.

High efficiency, large scale, stationary computing systems – supercomputers and data centers – are becoming increasingly important due to the movement of data storage and processing onto remote cloud servers. This book is dedicated to a technology particularly appropriate for this application – superconductive electronics, in particular, rapid single flux quantum circuits. The primary purpose of this book is to introduce and systematize recent developments in superconductive electronics into a cohesive whole to support the further development of large scale computing systems. A brief background into the physics of superconductivity and the operation of common superconductive devices is provided, followed by an introduction into different superconductive logic families, including the logic gates, interconnect, and bias current distribution. Synchronization, fabrication, and electronic design automation methodologies are presented, reviewing both widely established concepts and techniques as well as recent approaches. Issues related to memory, synchronization, interconnects, coupling noise, bias networks, signal interfaces, and deep scaling of superconductive structures and design for testability are described, and models, expressions, circuits, algorithms, and design methodologies are discussed and placed in context. The aim of this book is to provide insight and engineering intuition into the design of large scale digital superconductive circuits and systems.

High efficiency, large scale, stationary computing systems – supercomputers and data centers – are becoming increasingly important due to the movement of data storage and processing onto remote cloud servers. This book is dedicated to a technology particularly appropriate for this application – superconductive electronics, in particular, rapid single flux quantum circuits. The primary purpose of this book is to introduce and systematize recent developments in superconductive electronics into a cohesive whole to support the further development of large scale computing systems. A brief background into the physics of superconductivity and the operation of common superconductive devices is provided, followed by an introduction into different superconductive logic families, including the logic gates, interconnect, and bias current distribution. Synchronization, fabrication, and electronic design automation methodologies are presented, reviewing both widely established concepts and techniques as well as recent approaches. Issues related to memory, synchronization, interconnects, coupling noise, bias networks, signal interfaces, and deep scaling of superconductive structures and design for testability are described, and models, expressions, circuits, algorithms, and design methodologies are discussed and placed in context. The aim of this book is to provide insight and engineering intuition into the design of large scale digital superconductive circuits and systems.

Networks are pervasive. Very large scale integrated (VLSI) systems are no different, consisting of dozens of interconnected subsystems, hundreds of modules, and many billions of transistors and wires. Graph theory is crucial for managing and analyzing these systems. In this book, VLSI system design is discussed from the perspective of graph theory. Starting from theoretical foundations, the authors uncover the link connecting pure mathematics with practical product development. This book not only provides a review of established graph theoretic practices, but also discusses the latest advancements in graph theory driving modern VLSI technologies, covering a wide range of design issues such as synchronization, power network models and analysis, and interconnect routing and synthesis.Provides a practical introduction to graph theory in the context of VLSI systems engineering;Reviews comprehensively graph theoretic methods and algorithms commonly used during VLSI product development process;Includes a review of novel graph theoretic methods and algorithms for VLSI system design.

Networks are pervasive. Very large scale integrated (VLSI) systems are no different, consisting of dozens of interconnected subsystems, hundreds of modules, and many billions of transistors and wires. Graph theory is crucial for managing and analyzing these systems. In this book, VLSI system design is discussed from the perspective of graph theory. Starting from theoretical foundations, the authors uncover the link connecting pure mathematics with practical product development. This book not only provides a review of established graph theoretic practices, but also discusses the latest advancements in graph theory driving modern VLSI technologies, covering a wide range of design issues such as synchronization, power network models and analysis, and interconnect routing and synthesis.Provides a practical introduction to graph theory in the context of VLSI systems engineering;Reviews comprehensively graph theoretic methods and algorithms commonly used during VLSI product development process;Includes a review of novel graph theoretic methods and algorithms for VLSI system design.

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: Manufacturing techniques for 3-D ICs with TSVs Electrical modeling and closed-form expressions of through silicon vias Substrate noise coupling in heterogeneous 3-D ICs Design of 3-D ICs with inductive links Synchronization in 3-D ICs Variation effects on 3-D ICs Correlation of WID variations for intra-tier buffers and wires

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power delivery and management systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this fourth edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

This book describes methods for distributing power in high speed, high complexity integrated circuits with power levels exceeding many tens of watts and power supplies below a volt. It provides a broad and cohesive treatment of power distribution systems and related design problems, including both circuit network models and design techniques for on-chip decoupling capacitors, providing insight and intuition into the behavior and design of on-chip power distribution systems. Organized into subareas to provide a more intuitive flow to the reader, this second edition adds more than a hundred pages of new content, including inductance models for interdigitated structures, design strategies for multi-layer power grids, advanced methods for efficient power grid design and analysis, and methodologies for simultaneously placing on-chip multiple power supplies and decoupling capacitors. The emphasis of this additional material is on managing the complexity of on-chip power distribution networks.

Distributing power in high speed, high complexity integrated circuits has become a challenging task as power levels exceeding tens of watts have become commonplace while the power supply is plunging toward one volt. This book is dedicated to this important subject. The primary purpose of this monograph is to provide insight and intuition into the behavior and design of power distribution systems for high speed, high complexity integrated circuits.

The appropriate interconnect model has changed several times over the past two decades due to the application of aggressive technology scaling. New, more accurate interconnect models are required to manage the changing physical characteristics of integrated circuits. Currently, RC models are used to analyze high resistance nets while capacitive models are used for less resistive interconnect. However, on-chip inductance is becoming more important with integrated circuits operating at higher frequencies, since the inductive impedance is proportional to the frequency. The operating frequencies of integrated circuits have increased dramatically over the past decade and are expected to maintain the same rate of increase over the next decade, approaching 10 GHz by the year 2012. Also, wide wires are frequently encountered in important global nets, such as clock distribution networks and in upper metal layers, and performance requirements are pushing the introduction of new materials for low resistance interconnect, such as copper interconnect already used in many commercial CMOS technologies. On-Chip Inductance in High Speed Integrated Circuits deals with the design and analysis of integrated circuits with a specific focus on on-chip inductance effects. It has been described throughout this book that inductance can have a tangible effect on current high speed integrated circuits. For example, neglecting inductance and using an RC interconnect model in a production 0.25 mum CMOS technology can cause large errors (over 35%) in estimates of the propagation delay of on-chip interconnect. It has also been shown that including inductance in the repeater insertion design process as compared to using an RC model improves the overall repeater solution in terms of area, power, and delay with average savings of 40.8%, 15.6%, and 6.7%, respectively. On-Chip Inductance in High Speed Integrated Circuitsis full of design and analysis techniques for RLC interconnect. These techniques are compared to techniques traditionally used for RC interconnect design to emphasize the effect of inductance. On-Chip Inductance in High Speed Integrated Circuits will be of interest to researchers in the area of high frequency interconnect, noise, and high performance integrated circuit design.

History of the Book The last three decades have witnessed an explosive development in integrated circuit fabrication technologies. The complexities of cur­ rent CMOS circuits are reaching beyond the 100 nanometer feature size and multi-hundred million transistors per integrated circuit. To fully exploit this technological potential, circuit designers use sophisticated Computer-Aided Design (CAD) tools. While supporting the talents of innumerable microelectronics engineers, these CAD tools have become the enabling factor responsible for the successful design and implemen­ tation of thousands of high performance, large scale integrated circuits. This research monograph originated from a body of doctoral disserta­ tion research completed by the first author at the University of Rochester from 1994 to 1999 while under the supervision of Prof. Eby G. Friedman. This research focuses on issues in the design of the clock distribution net­ work in large scale, high performance digital synchronous circuits and particularly, on algorithms for non-zero clock skew scheduling. During the development of this research, it has become clear that incorporating timing issues into the successful integrated circuit design process is of fundamental importance, particularly in that advanced theoretical de­ velopments in this area have been slow to reach the designers' desktops.

Power Distribution Networks with On-Chip Decoupling Capacitors is dedicated to distributing power in high speed, high complexity integrated circuits with power levels exceeding tens of watts and the power supply below a volt. The book provides insight and intuition into the behavior and design of integrated circuit-based power distribution systems. The book has three primary objectives. The first is to describe the impedance characteristics of the overall power distribution system, from the voltage regulator through the printed circuit board and package onto the integrated circuit to the power terminals of the on-chip circuitry. The second is to discuss the inductive characteristics of on-chip power distribution grids and the related circuit behavior of these structures. The third objective is to present design methodologies for effciently placing on-chip decoupling capacitors in nanoscale integrated circuits. Power Distribution Networks with On-Chip Decoupling Capacitors is a reference for professional engineers in the fields of circuits and systems and computer-aided design.

History of the Book The last three decades have witnessed an explosive development in - tegrated circuit fabrication technologies. The complexities of current CMOS circuits are reaching beyond the 65 nanometer feature size and multi-hundred million transistors per integrated circuit. To fully exploit this technological potential, circuit designers use sophisticated Computer-Aided Design (CAD) tools. While supporting the talents of innumerable microelectronics engineers, these CAD tools have become the enabling factor responsible for the succe- ful design and implementation of thousands of high performance, large scale integrated circuits. This book (a research monograph) originated from a body of doctoral d- sertationresearchcompletedbythe?rstauthorattheUniversityofRochester from 1994 to 1999 while under the supervision of Prof. Eby G. Friedman. This research focuses on issues in the design of the clock distribution network in large scale, high performance digital synchronous circuits and particularly, on algorithmsfornon-zero clockskewscheduling.Duringthedevelopmentofthis research, it became clear that incorporating timing issues into the successful integrated circuit design process is of fundamental importance, particularly in that advanced theoretical developments in this area have been slow to reach the designers’ desktops. The second edition of the book is enhanced by the body of doctoral dissertation research completed by the second author at the University of Pittsburgh from 2000 to 2005 under the supervision of Prof.

History of the Book The last three decades have witnessed an explosive development in - tegrated circuit fabrication technologies. The complexities of current CMOS circuits are reaching beyond the 65 nanometer feature size and multi-hundred million transistors per integrated circuit. To fully exploit this technological potential, circuit designers use sophisticated Computer-Aided Design (CAD) tools. While supporting the talents of innumerable microelectronics engineers, these CAD tools have become the enabling factor responsible for the succe- ful design and implementation of thousands of high performance, large scale integrated circuits. This book (a research monograph) originated from a body of doctoral d- sertationresearchcompletedbythe?rstauthorattheUniversityofRochester from 1994 to 1999 while under the supervision of Prof. Eby G. Friedman. This research focuses on issues in the design of the clock distribution network in large scale, high performance digital synchronous circuits and particularly, on algorithmsfornon-zero clockskewscheduling.Duringthedevelopmentofthis research, it became clear that incorporating timing issues into the successful integrated circuit design process is of fundamental importance, particularly in that advanced theoretical developments in this area have been slow to reach the designers’ desktops. The second edition of the book is enhanced by the body of doctoral dissertation research completed by the second author at the University of Pittsburgh from 2000 to 2005 under the supervision of Prof.

With vastly increased complexity and functionality in the "nanometer era" (i.e. hundreds of millions of transistors on one chip), increasing the performance of integrated circuits has become a challenging task. Connecting effectively (interconnect design) all of these chip elements has become the greatest determining factor in overall performance. 3-D integrated circuit design may offer the best solutions in the near future. This is the first book on 3-D integrated circuit design, covering all of the technological and design aspects of this emerging design paradigm, while proposing effective solutions to specific challenging problems concerning the design of 3-D integrated circuits. A handy, comprehensive reference or a practical design guide, this book provides a sound foundation for the design of 3-D integrated circuits.

This book presents an in-depth treatment of various power reduction and speed enhancement techniques based on multiple supply and threshold voltages. A detailed discussion of the sources of power consumption in CMOS circuits will be provided whilst focusing primarily on identifying the mechanisms by which sub-threshold and gate oxide leakage currents are generated. The authors present a comprehensive review of state-of-the-art dynamic, static supply and threshold voltage scaling techniques and discuss the pros and cons of supply and threshold voltage scaling techniques.