Harold S. Morgan

Advances in computational power have facilitated the development of simulations unprecedented in their computational size, scope of technical issues, spatial and temporal resolution, complexity and comprehensiveness. As a result, complex structures from airplanes to bridges can be almost completely based on model-based simulations. This book gives a state-of-the-art account of modeling and simulation of the life cycle of engineered systems, covering topics of design, fabrication, maintenance and disposal. Providing comprehensive coverage of this rapidly emerging field, Modeling and Simulation-Based Life Cycle Engineering is essential reading for civil, mechanical and manufacturing engineers. It will also appeal to students and academics in this area.

Advances in computational power have facilitated the development of simulations unprecedented in their computational size, scope of technical issues, spatial and temporal resolution, complexity and comprehensiveness. As a result, complex structures from airplanes to bridges can be almost completely based on model-based simulations. This book gives a state-of-the-art account of modeling and simulation of the life cycle of engineered systems, covering topics of design, fabrication, maintenance and disposal. Providing comprehensive coverage of this rapidly emerging field, Modeling and Simulation-Based Life Cycle Engineering is essential reading for civil, mechanical and manufacturing engineers. It will also appeal to students and academics in this area.

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.