Kevin Slattery

Additive manufacturing (AM) technology, also known as 3D printing, has transitioned from concepts and prototypes to part-for-part substitution and the creation of unique AM-specific part geometries. These applications are increasingly present in demanding, mission-critical fields such as medicine and aerospace, which require materials with certain thermal, stiffness, corrosion, and static loading properties. To advance in these arenas, metallic, ceramic, and polymer composite AM parts need to be free from discontinuities.The manufacturing processes have to be stable, robust, and repeatable. And the nondestructive testing (NDT) technology and inspection methods will need to be sufficiently capable and reliable to ensure that discontinuities will be detected to prevent the components from being accepted for use. As the second installment of a six-part series of SAE EDGE(TM) Research Reports on AM, this one discusses the need, challenges, technologies, and opportunities for NDT in AM.NOTE: SAE EDGE(TM) Research Reports are intended to identify and illuminate key issues in emerging, but still unsettled, technologies of interest to the mobility industry. The goal of SAE EDGE(TM) Research Reports is to stimulate discussion and work in the hope of promoting and speeding resolution of identified issues. SAE EDGE(TM) Research Reports are not intended to resolve the challenges they identify or close any topic to further scrutiny.

Intra-system EMC problems are becoming increasingly common in mobile devices, ranging from notebook PCs to cell phones, with RF/wireless capbilities. These issues range from minor annoyances to serious glitches which impede the functioning of the device. This book gives a thourough review of electromagnetic theory (including Maxwell's equations), discusses possible sources and causes of intra-system interference, shows to use models and analysis to discover potential sources of intra-system EMC in a design, how to use appropriate tests and measurements to detect intra-system EMC problems, and finally extensively discusses measures to mitigate or totally eliminate intra-system EMC problems. With more and more mobile devices incorporating wirless capability (often with multiple wireless systems, such as Bluetooth and WiFi), this book should be part of the reference shelf of every RF/wireless engineer and mobile device designer.