Navid Asadizanjani

This book offers a comprehensive introduction and in-depth information on all the packaging technologies and fabrication methodologies employed in advanced semiconductor packaging. Coverage includes materials, substrates, and assembly processes, as well as critical areas of testing and reliability, which are crucial for ensuring the utmost quality and reliability of advanced packaging solutions.

This book provides a look into the future of hardware and microelectronics security, with an emphasis on potential directions in security-aware design, security verification and validation, building trusted execution environments, and physical assurance. The book emphasizes some critical questions that must be answered in the domain of hardware and microelectronics security in the next 5-10 years: (i) The notion of security must be migrated from IP-level to system-level; (ii) What would be the future of IP and IC protection against emerging threats; (iii) How security solutions could be migrated/expanded from SoC-level to SiP-level; (iv) the advances in power side-channel analysis with emphasis on post-quantum cryptography algorithms; (v) how to enable digital twin for secure semiconductor lifecycle management; and (vi) how physical assurance will look like with considerations of emerging technologies. The main aim of this book is to serve as a comprehensive and concise roadmap for new learners and educators navigating the evolving research directions in the domain of hardware and microelectronic securities. Overall, throughout 11 chapters, the book provides numerous frameworks, countermeasures, security evaluations, and roadmaps for the future of hardware security.

Materials for Electronics Security and Assurance reviews the properties of materials that could enable devices that are resistant to tampering and manipulation. The book discusses recent advances in materials synthesis and characterization techniques for security applications. Topics addressed include anti-reverse engineering, detection, prevention, track and trace, fingerprinting, obfuscation, and how materials could enable these security solutions. The book introduces opportunities and challenges and provides a clear direction of the requirements for material-based solutions to address electronics security challenges. It is suitable for materials scientists and engineers who seek to enable future research directions, current computer and hardware security engineers who want to enable materials selection, and as a way to inspire cross-collaboration between both communities.

This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.

This book provides readers with a comprehensive introduction to physical inspection-based approaches for electronics security. The authors explain the principles of physical inspection techniques including invasive, non-invasive and semi-invasive approaches and how they can be used for hardware assurance, from IC to PCB level. Coverage includes a wide variety of topics, from failure analysis and imaging, to testing, machine learning and automation, reverse engineering and attacks, and countermeasures.