Yong Liu

Network calculus is a theory dealing with queuing systems found in computer networks. Its focus is on performance guarantees. Central to the theory is the use of alternate algebras such as the min-plus algebra to transform complex network systems into analytically tractable systems. To simplify the ana- sis, another idea is to characterize tra?c and service processes using various bounds. Since its introduction in the early 1990s, network calculus has dev- oped along two tracks—deterministic and stochastic. This book is devoted to summarizing results for stochastic network calculus that can be employed in the design of computer networks to provide stochastic service guarantees. Overview and Goal Like conventional queuing theory, stochastic network calculus is based on properly de?ned tra?c models and service models. However, while in c- ventional queuing theory an arrival process is typically characterized by the inter-arrival times of customers and a service process by the service times of customers, the arrival process and the service process are modeled in n- work calculus respectively by some arrival curve that (maybe probabilis- cally) upper-bounds the cumulative arrival and by some service curve that (maybe probabilistically) lower-bounds the cumulative service. The idea of usingboundstocharacterizetra?candservicewasinitiallyintroducedfor- terministic network calculus. It has also been extended to stochastic network calculus by exploiting the stochastic nature of arrival and service processes.

Network calculus is a theory dealing with queuing systems found in computer networks. Its focus is on performance guarantees. Central to the theory is the use of alternate algebras such as the min-plus algebra to transform complex network systems into analytically tractable systems. To simplify the ana- sis, another idea is to characterize tra?c and service processes using various bounds. Since its introduction in the early 1990s, network calculus has dev- oped along two tracks—deterministic and stochastic. This book is devoted to summarizing results for stochastic network calculus that can be employed in the design of computer networks to provide stochastic service guarantees. Overview and Goal Like conventional queuing theory, stochastic network calculus is based on properly de?ned tra?c models and service models. However, while in c- ventional queuing theory an arrival process is typically characterized by the inter-arrival times of customers and a service process by the service times of customers, the arrival process and the service process are modeled in n- work calculus respectively by some arrival curve that (maybe probabilis- cally) upper-bounds the cumulative arrival and by some service curve that (maybe probabilistically) lower-bounds the cumulative service. The idea of usingboundstocharacterizetra?candservicewasinitiallyintroducedfor- terministic network calculus. It has also been extended to stochastic network calculus by exploiting the stochastic nature of arrival and service processes.

New Polymeric Products: Fundamentals, Forming Methods and Applications introduces applications of polymer materials in different fields, including new products and processing methods. This book is rich in content and creativity and introduces the development, history, characteristics and existing processing methods of polymer materials in a comprehensive and systematic manner. Sections include the latest achievements from future travel, energy problems, special environment, lens materials and biomedicine, which are the most concerning areas of human society today. The book also introduces forming principles, methods, achievements and development prospects from shallow to profound. It will benefit researchers and new academic participants and broaden their vision. Sections cover the development history and prospect of polymer materials, introduce polymer materials, including new materials, characteristics, synthesis, naming and functionality, and delve into new processing and forming methods which are introduced in three parts: plastic, rubber and fiber according to different product types.

The Tujia number over 8 million people and are one of the larger ethnic minority groups in China. However, little is known about their culture - especially their paintings and woodcarvings - which are not merely ornamental but also key components of their religious practices and rituals. Accompanied by many pictures and photos, this book explores the fabulous and unique Tujia works of art from the Qing period. Author Liu Yong, who has amassed an incredible collection of Tujia artwork (some of which is shown in this book), also explores the Nuo folk religion and its intimate connection with the Tujia. Traditionally the Tujia dwell in the Wuling Mountain area of southwestern China, on the borders of Hubei, Hunan, and Guizhou provinces. They rose to prominence during the Ming era (1368- 1644) and arguably reached their zenith during the Qing era (1644- 1911). It is hoped that through further research and understanding, invaluable Tujia customs and skillsets from previous generations will not be lost. For anyone interested in the Tujia, Nuo religion, or the art itself, this title is certainly recommended.

This book uses a system-based approach to decipher and organize the concepts and conclusions relevant for creating and capturing value in business. It develops a scientific theory based on systems science and logical reasoning that is commonly employed in mathematics and natural science. The resulting new theory focuses on the organizational nature of the world and the organic and holistic feature of human organizations and their interactions. To this end, this book identifies a few axioms, instead of empirical discoveries, on which it reliably constructs the entire theory.

Train, test, run, track, store, tune, deploy, and explain provenance-aware deep learning models and pipelines at scale with reproducibility using MLflowKey FeaturesFocus on deep learning models and MLflow to develop practical business AI solutions at scaleShip deep learning pipelines from experimentation to production with provenance trackingLearn to train, run, tune and deploy deep learning pipelines with explainability and reproducibilityBook DescriptionThe book starts with an overview of the deep learning (DL) life cycle and the emerging Machine Learning Ops (MLOps) field, providing a clear picture of the four pillars of deep learning: data, model, code, and explainability and the role of MLflow in these areas. From there onward, it guides you step by step in understanding the concept of MLflow experiments and usage patterns, using MLflow as a unified framework to track DL data, code and pipelines, models, parameters, and metrics at scale. You'll also tackle running DL pipelines in a distributed execution environment with reproducibility and provenance tracking, and tuning DL models through hyperparameter optimization (HPO) with Ray Tune, Optuna, and HyperBand. As you progress, you'll learn how to build a multi-step DL inference pipeline with preprocessing and postprocessing steps, deploy a DL inference pipeline for production using Ray Serve and AWS SageMaker, and finally create a DL explanation as a service (EaaS) using the popular Shapley Additive Explanations (SHAP) toolbox. By the end of this book, you'll have built the foundation and gained the hands-on experience you need to develop a DL pipeline solution from initial offline experimentation to final deployment and production, all within a reproducible and open source framework.What you will learnUnderstand MLOps and deep learning life cycle developmentTrack deep learning models, code, data, parameters, and metricsBuild, deploy, and run deep learning model pipelines anywhereRun hyperparameter optimization at scale to tune deep learning modelsBuild production-grade multi-step deep learning inference pipelinesImplement scalable deep learning explainability as a serviceDeploy deep learning batch and streaming inference servicesShip practical NLP solutions from experimentation to productionWho this book is forThis book is for machine learning practitioners including data scientists, data engineers, ML engineers, and scientists who want to build scalable full life cycle deep learning pipelines with reproducibility and provenance tracking using MLflow. A basic understanding of data science and machine learning is necessary to grasp the concepts presented in this book.

This book uses a system-based approach to decipher and organize the concepts and conclusions relevant for creating and capturing value in business. It develops a scientific theory based on systems science and logical reasoning that is commonly employed in mathematics and natural science. The resulting new theory focuses on the organizational nature of the world and the organic and holistic feature of human organizations and their interactions. To this end, this book identifies a few axioms, instead of empirical discoveries, on which it reliably constructs the entire theory.

Melt Electrospinning: A Green Method to Produce Superfine Fibers introduces the latest results from a leading research group in this area, exploring the structure, equipment polymer properties and spinning conditions of melt electrospinning. Sections introduce the invention of melt electrospinning, including the independent development of centrifugal melt electrospinning and upward melt electrospinning, discuss electro magnetization of melt and the testing method of fiber performance by means of different polymers and self-designed devices, cover simulation, and introduce principle methods and improvement measures of centrifugal melt electrospinning.

This book argues that 3D films are becoming more sophisticated in utilising stereoscopic effects for storytelling purposes. Since Avatar (2009), we have seen a 3D revival marked by its integration with new digital technologies. With this book, the author goes beyond exploring 3D’s spectacular graphics and considers how 3D can be used to enhance visual storytelling. The chapters include visual comparisons between 2D and 3D to highlight their respective narrative features; an examination of the narrative tropes and techniques used by contemporary 3D filmmakers; and a discussion of the narrative implications brought by the coexistence of flatness and depth in 3D visuality. In demonstrating 3D cinematic aesthetics and storytelling, Yong Liu analyses popular films such as Hugo (2011), Life of Pi (2012), Gravity (2013), Star Trek Into Darkness (2013, and The Great Gatsby (2013). The book is an investigation into contemporary forms of stereoscopic storytelling derived from a unique, long-existing mode of cinematic illusions.

This book argues that 3D films are becoming more sophisticated in utilising stereoscopic effects for storytelling purposes. Since Avatar (2009), we have seen a 3D revival marked by its integration with new digital technologies. With this book, the author goes beyond exploring 3D’s spectacular graphics and considers how 3D can be used to enhance visual storytelling. The chapters include visual comparisons between 2D and 3D to highlight their respective narrative features; an examination of the narrative tropes and techniques used by contemporary 3D filmmakers; and a discussion of the narrative implications brought by the coexistence of flatness and depth in 3D visuality. In demonstrating 3D cinematic aesthetics and storytelling, Yong Liu analyses popular films such as Hugo (2011), Life of Pi (2012), Gravity (2013), Star Trek Into Darkness (2013, and The Great Gatsby (2013). The book is an investigation into contemporary forms of stereoscopic storytelling derived from a unique, long-existing mode of cinematic illusions.

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Analog and Power Wafer Level Chip Scale Packaging presents a state-of-art and in-depth overview in analog and power WLCSP design, material characterization, reliability and modeling. Recent advances in analog and power electronic WLCSP packaging are presented based on the development of analog technology and power device integration. The book covers in detail how advances in semiconductor content, analog and power advanced WLCSP design, assembly, materials and reliability have co-enabled significant advances in fan-in and fan-out with redistributed layer (RDL) of analog and power device capability during recent years. Since the analog and power electronic wafer level packaging is different from regular digital and memory IC package, this book will systematically introduce the typical analog and power electronic wafer level packaging design, assembly process, materials, reliability and failure analysis, and material selection. Along with new analog and power WLCSP development, the roleof modeling is a key to assure successful package design. An overview of the analog and power WLCSP modeling and typical thermal, electrical and stress modeling methodologies is also presented in the book.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first timeProvides the skills necessary for virtual prototyping and virtual reliability qualification and testingDemonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic productsCovers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnectsAppendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging